Semiconductors: how Air Liquide optimizes chip manufacturing with its advanced materials?

Published on February 25, 2026

1 minute

Manufacturing tomorrow’s chips involves hundreds of steps and tolerates no impurities or interruption. At the heart of this challenge lie deposition and etching, among the most critical steps in the manufacturing process, which require atomic-scale precision. Discover how Air Liquide’s advanced materials shape the circuits of our connected devices with absolute integrity.

Beyond the ultra-pure gases used at every stage of semiconductor manufacturing, Air Liquide also develops advanced materials. These are highly engineered, innovative molecules designed to meet the extreme technical requirements of next-generation chips. 

Air Liquide’s role in the manufacturing of semiconductors

How do Air Liquide’s advanced materials impact next-generation semiconductor manufacturing? By being essential for two major steps in chips’ making: etching and deposition.

  • Etching carves the complex electrical circuits and components. To successfully achieve deep etching with maximum reliability, Air Liquide designs specialized etching molecules.
  • Deposition forms and connects the nano-components of the electrical circuit. Air Liquide develops advanced materials, called “precursors”, that enable layer-by-layer deposition with atomic-scale precision.

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Air Liquide thus plays a key part in the highly strategic semiconductor industry that supports, among others, the boom of Artificial Intelligence and cloud computing.

Learn more about semiconductors